Flux Paste RELIFE RL-223-OR, (for lead-free soldering, high-level, 100 g)
id: 885621
Bestseller
id: 885621 0.1 kg
Availability in stock:
HK
Lead-free highly active solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards. No residue.
Add to wishlist
Compare
Compare
Suggest your price
Buy wholesale and save
RELIFE RL-223-OR is a lead free high quality solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
Features
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.
Technical Specifications
Net weight | 100 g |
Package Dimensions | 65 × 75 × 60 mm |
Package Contents
- Solder Paste RELIFE RL-223-OR (100 g) — 1 pc.
Flux paste characteristics:
- High-level
Flux paste weight:
- 100 g
Flux paste intended purpose:
- For lead-free soldering