Flux Pastes

Lead-free highly active solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards. No residue.

Light yellow solder paste for soldering and reballing BGA and PGA components on phone mainboards. No rinsing.

High viscosity lead free solder paste designed for soldering and reballing SMD components and PCB. No residue.

Strong active insulating flux paste for repairing mobile phones motherboards, CPU, etc. Lead-free and halogen-free. High insulation resistance.

Gel-like acid-free flux paste without impurities. Used for electronic components soldering and reballing. Features strong activity and high insulation resistance.

Highly active halogen-free viscous soldering paste. Due to high insulation resistance, it can be used for PCB soldering and reballing.

Milky white soldering paste, not containing lead and halogens. Features high insulation resistance. It provides quick and high-quality tinning.

Gel-like acid-free flux paste without impurities. Used for electronic components soldering and reballing. Features strong activity and high insulation resistance.

Not suitable for SMD and BGA soldering. Prevents from defects emergence. The paste has a good diffusion and non-corrosion properties.

Neutral (pH 7±0.3) non-toxic soldering paste for copper and steel. Weight: 50 g.