Flash & Unlock for Vodafone

DC-unlocker is the software, which is specialized on data card servicing.

DC-unlocker is the software, which is specialized on data card servicing.

Avengers Dongle is an unlimited network decoding tool for servicing a wide range of mobile devices.

This UFS BGA-153 Socket Adapter is intended for Medusa Pro II Box

Z3X Easy-Jtag Plus UFS Kit includes BGA-95, BGA-153, and BGA-254 socket adapters.

This offer allows you to extend you access to Furious support and add 10 Furious Pack activations.

This UFS BGA-254 Socket Adapter is intended for Medusa Pro II Box

Hydra ISP Adapter Set allows you to service any device with eMMC and ISP pinouts available.

This adapter will expand possiblities of your ICFRIEND EMMC / UFS set.

TFM Pro is a multibrand tool for servicing smartphones based on MTK, Qualcomm, and Spreadtrum.

These credits are intended for server authentication (vivo-auth) of VIVO phones and Reset FRP on Samsung phones.

This activation only allows RENEW ACCESS for users who own Sigma Plus box or dongle.

Hydra Tool Dongle is one of the most advanced platforms for mobile decoding and repairing Xiaomi, Samsung, Vivo, OPPO, Realme, Huawei, Honor, Lenovo, and Motorola smartphones.

This adapter allows you to connect to devices with ISP pinouts via the UFS and EMMC interfaces.

This ISP Adapter is intended for the Flash 64 programmer. Manufactured by ICFRIEND.

This eMMC ISP adapters kit is intended for work with Flash64 Box, UFI Box, Easy JTAG Plus Box.

DC-unlocker is a service solution for Option, Huawei, Sierra Wireless, Novatel and Dell data cards. DC-unlocker Standard Pack comes with 50 DC-unlocker credits

NCK Pro Dongle (NCK Dongle + UMT) activated with ACT1, CDMA and Iden/Palm - unlimited phone Flashing, mobile decoding and code calculation tool for Alcatel, BlackBerry, Doro, HTC, Huawei, LG, Motorola, Pantech, Samsung, Sony Ericsson, SFR, ZTE and Palm cell phones.

Medusa PRO II Box is a brand new version of the professional phone servicing tool intended for a wide range of Samsung, Huawei, LG, Lenovo, Motorola, Oppo, Sony, Xiaomi, ZTE and other devices through USB, UFS and MMC interfaces.

New platform for convenient and effective BGA reballing of EMMC / EMCP / UFS chips (BGA153 / BGA162 / BGA169 / BGA186 / BGA221 / BGA254 / BGA297). Fixed Plate and Magnetic Base Holder are included.

This holder with stencil net set is intended for reballing of 99% ICs on the market such as A8-A17 for iPhone 6 up to 15 series, as well as Qualcomm Snapdragon, Hisilicon Kirin, MTK Dimensity, and Samsung Exynos series.

This holder with stencil net set is intended for reballing of 99% ICs on the market such as A8-A18Pro for iPhone 6 up to 16 series, as well as Qualcomm Snapdragon, Hisilicon Kirin, MTK Dimensity, and Samsung Exynos series.