BGA Rework System Quick EA-H15
id: 869160
BGA Rework System Quick EA-H15
General information
Video
Warranty
USD 13750.00
General information
Video
144 kg 220 V Warranty: 12 months
Repair system with the increased power (2400 W) for soldering and desoldering various components.
USD 13750.00
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Quick EA-H15 – repair system with the increased power for soldering and desoldering various components.
The system is an upgraded version of QUICK BGA2015 station and consists of the QUICK IR EA-H15 infrared rework station, QUICK PL EA-H15 precise laser mounting system, QUICK RPC EA-H15 visualization camera.
Features
- Perfect for soldering and reworking of CBGA, CCGA, CSP, QFN, MLF, PGA and others.
- Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution.
- PL Precise aligning and placing system: visible double-colors optical lens alignment, overlap alignment between solder ball and soldering pad is scientific and accurate; easy control, and pick-up and placement.
- The whole process can be recorded, controlled and analyzed and then generate curve diagram by connecting to PC using IRsoft Software.
- Programmable soldering control system, 10 modes storage memory, password protection
- Bottom heater large size prevents the PCB from irregular heating and damage
- Microprocessor control and low-inertial heaters ensure the maximum thermal stability
- Laser LED pointer to highlight the operation area center
- Built-in vacuum pump for component pick-up (max 0.05 MPa)
- Upper LED light: blue color, adjustable brightness
- Lower LED light: yellow color, adjustable brightness
- Multi-purpose holder frame with flexible fixation for tiny and complex-shape PCBs included
- Monitor (option)
- Upper and bottom cooling fans included
Technical Specifications
| General Power | 2400 W (max.) |
| Top Heater Power | 720 W (120 W×6, infrared heating tube, wavelength: 2~8 µm) |
| Bottom Heater Power | 1600 W (400 W×4, infrared ceramic heater) – standard 2000 W (500 W×4, infrared ceramic heating tubes) – option |
| Top heater range size | 20 ~ 60 mm (X, Y axes alignment) |
| Bottom Heater Size | 260×260 mm |
| Max PCB Size | 400×400 mm |
| Max SMD (BGA) Components Size | 60×60 mm |
| Temperature Sensor | Infrared, 0…300°C |
| Positioning Camera | Magnification:: 220x (22x optical + 10x digital), Horizontal resolution: 480 TV lines, PAL format, power 12 V/300 mA |
| RPC Visualization Camera | Magnification: 220x (22x optical + 10x digital), Horizontal resolution: 480 TV lines, PAL format |
| Dimensions (L×W×H) | 850×720×730 mm |
| Weight | ~ 75 kg |
Video
User Manual
Download Quick EA-H15 Operation Manual.
Compatibility
- Main Unit Quick BGA EA-H15 — 1 pc..
- Control box
- IR Camera RPC
- Video line
- USB connect line
- Video capture card
- BGA tool box
- Operation Manual
Note! The monitor is not included in the package and may be ordered as an option.
BGA rework systems bottom heater size:
- 260 x 260 mm
BGA rework systems total power:
- 2800 W
BGA rework systems control type:
- Microcontroller / PC synchronization
BGA rework systems upper heater type:
- Ceramic
BGA rework systems bottom heater type:
- Ceramic
BGA rework systems upper heater power:
- 720 W
Video
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