BGA Paste Mechanic XG30, (Sn 63%, Pb 37%, 183 °C, 16 g)

Soldering pastes for BGA components.

BGA paste tin content:

• Sn 63%

BGA paste lead content:

• Pb 37%

BGA paste температура плавлення:

• 183 °C

BGA paste weight:

• 16 g