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RB-01 Reballing Stencil Tin Net Full Set for EMMC / EMCP / UFS
New platform for convenient and effective BGA reballing of EMMC / EMCP / UFS chips (BGA153 / BGA162 / BGA169 / BGA186 / BGA221 / BGA254). Fixed Plate and Magnetic Base Holder are included.
ID: 907761 0.25 kg
Availability in stock:
HK EU
USD 39.90
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