Infrared BGA Rework System Quick 7610
id: 886742
Infrared BGA Rework System Quick 7610
General information
Warranty
Price coming soon
General information
73 kg Warranty: 12 months
Lead-free BGA repairing system with the increased power (2400 W) for soldering and desoldering various SMT components.
Price coming soon
Quick 7610 is a microprocessor-controlled BGA rework system for BGA/CSP and other SMT components soldering and desoldering using infrared heating and hot air heating technologies. IRSoft software enables control of the soldering process and performs profile analysis functions.
The Quick 7610 rework system is designed for both the manufacturing and repair of modern electronic devices such as smartphones, computers, industrial controllers, all kinds of equipment.
Features
- No need of nozzles.
- No airflow in BGA ball process, which guarantees the high rate of success.
- Top dark-infrared open type of heating, large area bottom infrared preheating, decrease the vertical temperature difference between BGA surface and soldering joints, shorten the rework time.
- Use non-contact infrared temperature sensor, full-closed loop control of the temperature of BGA surface, ensure precise temperature process and even heat distribution.
- The PCB fixture can be moved in four directions, easy installation.
- Multifunctional frame holder for miniature and complex PCBs.
- Station control unit is located on the body.
- Side cooling fan.
Technical Specifications
| Total power | 2400 W (max.) |
| Power supply | 220 V AC, 50 Hz |
| Bottom preheating power | 1600 W (IR ceramic panel) |
| Top hot air heating power | 720 W (infrared heating tubes, wavelength: 2-8 um, size: 60 × 60 mm) |
| Bottom preheating power | 260×260 mm |
| Max. circuit board size | 420×400 mm |
| Max. BGA size | 60×60 mm |
| Communication | RS-232C (connected with PC) |
| Infrared temperature sensor | 0-300℃ |
| USB port | output DC 5V, 1A |
| Dimensions | 800 mm × 580 mm × 520 mm |
| Weight | 54 kg |
Package Contents
- Infrared BGA Rework System Quick 7610 — 1 pc.
- Cooling Fan — 1 pc.
- Soldering Paste — 1 pc.
- Brush — 1 pc.
- Tweezers — 1 pc.
- Thermal Tape — 1 pc.
- Desoldering Wick — 1 pc.
- Alcohol Pot — 1 pc.
- Cotton Buds — 1 set
- Crosshead Screwdriver — 1 pc.
- Hex Key Sets — 1 pc.
- Protective Gloves — 1 set
- Large PCB Holder — 3 pcs.
- Small PCB Holder — 3 pcs.
- USB Flash Drive — 1 pc.
- BGA Balls — 4 sets
- Ground Cable — 1 pc.
- Crocodile Clip — 1 pc.
- RS232 Cable — 1 pc.
- User Manual — 1 pc.
BGA rework systems bottom heater size:
- 260 x 260 mm
BGA rework systems control type:
- Microcontroller / PC synchronization
BGA rework systems upper heater type:
- Quartz
BGA rework systems bottom heater type:
- Quartz
BGA rework systems upper heater power:
- 720 W
BGA rework systems total power:
- 2400 W
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