BGA Paste RELIFE RL-406, (Sn 99%, Ag 0,3%, Cu 0,7%, 40 g)

Soldering pastes for BGA components.

BGA paste weight:

• 40 g

BGA paste silver content:

• Ag 0,3%

BGA paste copper content:

• Cu 0,7%

BGA paste tin content:

• Sn 99%