BGA Paste Mechanic XP7, (Sn 63%, Pb 37%, 148 °C, 60 g)

Soldering pastes for BGA components.

BGA paste tin content:

• Sn 63%

BGA paste lead content:

• Pb 37%

BGA paste weight:

• 60 g

BGA paste температура плавлення:

• 148 °C