BGA Paste Mechanic XP2, (Sn 63%, Pb 37%, 148 °C, 20 g)

Soldering pastes for BGA components.

BGA paste weight:

• 20 g

BGA paste tin content:

• Sn 63%

BGA paste lead content:

• Pb 37%

BGA paste температура плавлення:

• 148 °C