BGA Paste Mechanic XG50, (Sn 63%, Pb 37%, 183 °C, 35 g)

Soldering pastes for BGA components.

BGA paste weight:

• 35 g

BGA paste tin content:

• Sn 63%

BGA paste lead content:

• Pb 37%

BGA paste температура плавлення:

• 183 °C