BGA Paste Mechanic V4B45, (Sn 42%, lead-free, Bi 58%, 138 °C, 40 g)

Soldering pastes for BGA components.

BGA paste вміст бісмуту:

• Bi 58%

BGA paste температура плавлення:

• 138 °C

BGA paste lead content:

• Lead-free

BGA paste tin content:

• Sn 42%

BGA paste weight:

• 40 g