BGA Paste Mechanic TS17, (Sn 96.5%, Ag 3%, Cu 0.5%, 217 °C, 20 g)

Soldering pastes for BGA components.

BGA paste weight:

• 20 g

BGA paste tin content:

• Sn 96.5%

BGA paste copper content:

• Cu 0.5%

BGA paste silver content:

• Ag 3%

BGA paste температура плавлення:

• 217 °C