Lead-Free BGA Rework System QUICK 7710

id: 885519
id: 885519 75 kg 220 V Warranty: 12 months
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Lead-free BGA repairing system with the increased power (3500 W) for soldering and desoldering various SMT components.
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Overview
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Overview

QUICK 7710 – BGA repairing system with microprocessor control for BGA / CSP and other SMT components soldering and desoldering using infrared heating and hot air heating technologies. Used for working with lead-free soldering alloys.

You may use the integrated QUICK 7710 process control software BGA Soft to facilitate the realization of multiple control using a PC and to save the needed data. The system allows to fulfill the process automatically and may operate autonomously without using a PC – the data will be displayed on QUICK 7710 own LCD.

Features

  • Infrared heating and hot air heating technologies.
  • Heating up to 400℃.
  • May operate autonomously without using a PC.
  • BGA Soft for process control.

Technical Specifications

Total power 3500 W (max.)
Power supply 220 V AC, 50 Hz
Top hot air heating power 800 W
Bottom preheating power 1600 W (400 W×4, infrared heating)
Smallest chip size 2×2 mm
Maximum chip size 60×60 mm
Adjustable side wind speed cooling fan ≦ 3.5 m³ / min
Hot air heating temperature 500 ℃ (max)
IR preheating temperature 500 ℃ (max)
Bottom preheater size 330×360 mm
Temperature probe  K-type sensor, 3 pcs
Communication interface RS-232C (PC connection)
Dimensions   650×570×500 mm
Weight   ~ 44 kg

Package Contents

  • Upper Heater Nozzle — 3 pcs.
  • Thermocouple — 3 pcs.
  • BGA Balls — 4 set.
  • Thermal Tape — 1 pc.
  • Aluminum Tape — 1 pc.
  • Desoldering Wick — 1 pc.
  • Alcohol Pot — 1 pc.
  • Flux Paste — 1 pc.
  • Tweezers — 1 pc.
  • Crosshead Screwdriver — 1 pc.
  • Brush — 1 pc.
  • Hex Key Se — 1 set.
  • Ground Cable — 1 pc.
  • Ground Cable Clamp — 1 pc.
  • Cotton Swabs — 1 set.
  • Protective Gloves — 1 pair.
  • Software CD — 1 pc.
  • User Manual — 1 pc.

BGA rework systems total power:

  • 2800 W

BGA rework systems control type:

  • Microcontroller / PC synchronization

BGA rework systems upper heater type:

  • Hot air

BGA rework systems bottom heater type:

  • Ceramic

BGA rework systems bottom heater size:

  • 330 × 360 mm

BGA rework systems upper heater power:

  • 1200 W
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