Hot Air Soldering Stations Manufacturer: Quick

Microprocessor-controlled soldering station for soldering and desoldering SOIC, CHIP, QFP, PLCC, BGA, etc. Hot air gun power: 1000 W. Temperature range: 100-500 °C

Hot air rework station for soldering and desoldering SOIC, CHIP, QFP, PLCC, BGA, etc. Hot air gun power: 580 W. Temperature range: 100-450°C.

Powerful ESD safe hot air rework system for soldering and desoldering with a soldering and desoldering iron, hot air gun and a built-in vacuum pump.

Hot air rework station for lead-free soldering with 1200 W heating power, temperature range from 100°C to 500°C, max. air volume 200 L/min.

Hot air rework station for lead-free soldering with 1200 W heating power, temperature range from 100°C to 500°C, max. air volume 200 L/min. Suction pen provided.

Hot air rework system for soldering and desoldering with a hot air gun and a built-in vacuum pump.

Hot air rework system with soldering power: 90 W, hot air power: 1000 W.