Hybrid BGA Rework System Scotle IR360 PRO V3

Scotle IR360 PRO V3 Hybrid BGA Rework System is a powerful rework station based on hybrid heating technology which combines infrared and hot air heating technologies, as well as contact soldering for reworking of SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and other components.

Applications

• Repairing PS3 and Xbox 360 game consoles
• Repairing computers, cell phones, industrial computers, switches, graphics cards, shielding enclosures, CPU's seats, components slots and other large circuit boards with large chips up to 65x65 mm
• Repairing CBGA, CCGA, CSP, QFN, MLF, PGA and μBGAs
• Repairing small resistors, capacitors and so on

Features

• 3 independent temperature zones, top is dark infrared (you can change it into hot air head easily as you like ), lower is hot air heater and bottom is large infrared pre-heater.
• Infrared ceramic preheating system.
• High-power cross-flow cooling system to accelerate the preheating zone cooling.
• Using high-tech temperature control program.
• Can be easily used in leaded and lead free rework.
• Dual LED light design, more convenient to observe the reworking process.

Technical Specifications

Package Contents

• Scotle IR360 PRO V3 BGA Rework System main unit — 1 pc.
• Soldering iron stand — 1 pc.
• Hot air nozzles (55×55 mm, 41×41 mm, 38×38 mm, 34×34 mm, 31×31 mm) — 5 pcs.
• K-type thermcouple — 1 pc.
• Red brush — 1 pc.
• Vacuum suction pen with 2 suction pads — 1 pc.
• User manual — 1 pc.

BGA rework systems bottom heater size:

• 32 x 37,5 cm

BGA rework systems control type:

• Microcontroller / PC synchronization

BGA rework systems upper heater type:

• Mixed

BGA rework systems bottom heater type:

• Mixed

BGA rework systems total power:

• 3530 W

BGA rework systems upper heater power:

• 800 W