Soldering Paste Pro'sKit 8S005 (50 g)

id: 4847
id: 4847 0.05 kg
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Not suitable for SMD and BGA soldering. Prevents from defects emergence. The paste has a good diffusion and non-corrosion properties.
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Overview
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Overview

Pro'sKit 8S005 is a soldering paste (50 g). Not suitable for SMD and BGA soldering. Prevents from defects emergence. The paste has a good diffusion and non-corrosion properties.

Features

  • Composed of metal powder activated flux and blending agents.
  • The area and thickness to be soldered can be easily controlled. No spot appears in non-soldered area.
  • The paste has a good diffusion and non-corrosion properties.

Technical Specifications

Weight 50 g
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Soldering Paste Pro'sKit 8S005 50 g  - /*Short description|product*/
ID: 4847
Soldering Paste Pro'sKit 8S005 (50 g)
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